Substrate processing apparatus and substrate processing method

ABSTRACT

One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber. The substrate is transported to the sub-transport mechanism in the sub-transport chamber by the main transport mechanism in another processing block, and is transported to the main transport mechanism in the indexer block by the sub-transport mechanism in the sub-transport chamber.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.14/084,067, filed Nov. 19, 2013, which claims the benefit of JapanesePatent Application No. 2012-270506, filed Dec. 11, 2012, bothincorporated herein by reference.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a substrate processing apparatus and asubstrate processing method.

Description of Related Art

Substrate processing apparatuses are used to subject various types ofsubstrates such as semiconductor substrates, substrates for liquidcrystal displays, plasma displays, optical disks, magnetic disks,magneto-optical disks, and photomasks, and other substrates to varioustypes of processing (see JP 2011-66049 A, for example).

The substrate processing apparatus described in JP 2011-66049 A includesan indexer block and first and second processing blocks. The first andsecond processing blocks include first and second transport sections,respectively. The unprocessed substrate is transported from the indexerblock to the first processing block by the first transport section. Inthe first processing block, first processing is performed on thesubstrate. Thereafter, the substrate is received and transferred to thesecond transport section by the first transport section, and istransported to the second processing block by the second transportsection. In the second processing block, second processing is performedon the substrate.

BRIEF SUMMARY OF THE INVENTION

In the substrate processing apparatus described in JP 2011-66049 A, thefirst and second transport sections transport the above-mentionedsubstrates such that various types of processing are performed on thesubstrates. However, when processing different and independent from eachother is performed in the first and second processing blocks using thissubstrate processing apparatus, throughput of the second processingblock is restricted by throughput of the first processing block.

An object of the present invention is to provide a substrate processingapparatus and a substrate processing method in which throughput can beimproved.

(1) According to one aspect of the present invention, a substrateprocessing apparatus includes first, second and third processingregions, and a sub-transport region, wherein the second processingregion is arranged between the first processing region and the thirdprocessing region, the first processing region includes a first maintransport mechanism that transports a substrate, the second processingregion includes a first processing section that performs processing onthe substrate and a second main transport mechanism that transports thesubstrate, the third processing region includes a third main transportmechanism that transports the substrate, the sub-transport regionincludes a sub-transport mechanism that transports the substrate, thesecond main transport mechanism is configured to transport the substratebetween the first main transport mechanism and the first processingsection, and the sub-transport mechanism is configured to transport thesubstrate from the first main transport mechanism to the third maintransport mechanism and to transport the substrate from the third maintransport mechanism to the first main transport mechanism.

In the substrate processing apparatus, the second processing region isarranged between the first processing region and the third processingregion. The one substrate is transported to the second main transportmechanism in the second processing region by the first main transportmechanism in the first processing region, and is transported to thefirst processing section by the second main transport mechanism. Theprocessing is performed on the substrate by the first processingsection. The substrate after the processing is transported to the firstmain transport mechanism by the second main transport mechanism.

Further, another substrate is transported to the sub-transport mechanismin the sub-transport region by the first main transport mechanism in thefirst processing region, and is transported to the third main transportmechanism in the third processing region by the sub-transport mechanism.Further, the substrate is transported to the sub-transport mechanism inthe sub-transport region by the third main transport mechanism in thethird processing region, and is transported to the first main transportmechanism in the first processing region by the sub-transport mechanism.

This configuration enables the substrate to be transported between thefirst processing region and the third processing region without the useof the second main transport mechanism in the second processing region.Thus, the throughput in the first or third processing region can beprevented from being restricted by the throughput in the secondprocessing region. Therefore, the throughput of the substrate processingapparatus can be improved.

(2) The third processing region may further include a second processingsection that performs processing on the substrate, and the third maintransport mechanism may be configured to transport the substrate betweenthe sub-transport mechanism and the second processing section.

Such configuration enables independent processing to be concurrentlyperformed on the respective substrates in the first processing sectionin the second processing region and in the second processing section inthe third processing region. In this case, the second main transportmechanism and the third main transport mechanism can perform the same orsimilar transportation. Thus, control of the transportation of thesubstrate by the second and third main transport mechanisms can beprevented from being complicated. Therefore, software that controls thesecond and third main transport mechanisms can be simplified.

(3) The substrate processing apparatus may further include a firstsubstrate platform on which the substrate that is transported betweenthe first main transport mechanism and the sub-transport mechanism istemporarily placed, and a second substrate platform on which thesubstrate that is transported between the third main transport mechanismand the sub-transport mechanism is temporarily placed.

In this case, the substrate is transported between the first maintransport mechanism and the sub-transport mechanism via the firstsubstrate platform. Further, the substrate is transported between thesub-transport mechanism and the third main transport mechanism via thesecond substrate platform. Thus, even when the transport speeds of thefirst main transport mechanism and the sub-transport mechanism aredifferent, the substrate can be reliably transported between the firstmain transport mechanism and the sub-transport mechanism. Further, evenwhen the transport speeds of the sub-transport mechanism and the thirdmain transport mechanism are different, the substrate can be reliablytransported between the sub-transport mechanism and the third maintransport mechanism.

(4) The first processing section may include a first liquid processingunit that performs processing using a processing liquid on the substrateand a first thermal processing unit that performs thermal processing onthe substrate, the second processing section may include a second liquidprocessing unit that performs processing using a processing liquid onthe substrate and a second thermal processing unit that performs thermalprocessing on the substrate, the second processing region may include afirst liquid processing region in which the first liquid processing unitis arranged, a first thermal processing region in which the firstthermal processing unit is arranged and a first main transport region inwhich the second main transport mechanism is arranged, the thirdprocessing region may include a second liquid processing region in whichthe second liquid processing unit is arranged, a second thermalprocessing region in which the second thermal processing unit isarranged and a second main transport region in which the third maintransport mechanism is arranged, the first and second liquid processingregions may be arranged to be adjacent to each other in a firstdirection, the first and second thermal processing regions may bearranged to be adjacent to each other in the first direction and thefirst and second main transport regions may be arranged to be adjacentto each other in the first direction, the first main transport regionmay be arranged between the first liquid processing region and the firstthermal processing region in a second direction that intersects thefirst direction, and the second main transport region may be arrangedbetween the second liquid processing region and the second thermalprocessing region in the second direction, the sub-transport region maybe provided to extend in the first direction on an opposite side to thefirst and second main transport regions with respect to the first andsecond thermal processing regions, and the first substrate platform maybe arranged between the first main transport region and thesub-transport region, and the second substrate platform may be arrangedbetween the second main transport region and the sub-transport region.

In this case, with a simple configuration, the substrate is transportedto the first liquid processing unit in the first liquid processingregion and is transported to the first thermal processing unit in thefirst thermal processing region by the second main transport mechanismin the first main transport region.

Further, with a simple configuration, the substrate is transportedbetween the first main transport mechanism and the sub-transportmechanism via the first substrate platform, and is transported betweenthe sub-transport mechanism and the third main transport mechanism inthe second main transport region via the second substrate platform.Further, with a simple configuration, the substrate is transported tothe second liquid processing unit in the second liquid processing regionand is transported to the second thermal processing unit in the secondthermal processing region by the third main transport mechanism.

Thus, the liquid processing and the thermal processing can beindependently and concurrently performed on the respective substrates inthe second processing region and the third processing region. Therefore,it is possible to improve the throughput of the substrate processingapparatus without complicating the configuration and the control of thesubstrate processing apparatus.

(5) The first processing section may include a first lower processingsection, and a first upper processing section arranged above the firstlower processing section, the second main transport mechanism mayinclude a first lower main transport mechanism that carries in thesubstrate from and carries out the substrate to the first lowerprocessing section, and a first upper main transport mechanism arrangedabove the first lower main transport mechanism and carries in thesubstrate from and carries out substrate to the first upper processingsection, the second processing section may include a second lowerprocessing section, and a second upper processing section arranged abovethe second lower processing section, the third main transport mechanismmay include a second lower main transport mechanism that carries in thesubstrate from and carries out the substrate to the second lowerprocessing section, and a second upper main transport mechanism arrangedabove the second lower main transport mechanism and carries in thesubstrate from and carries out the substrate to the second upperprocessing section, the sub-transport mechanism may include a firstsub-transport mechanism configured to transport the substrate from thefirst main transport mechanism to the second lower main transportmechanism and to transport the substrate from the second lower maintransport mechanism to the first main transport mechanism, and a secondsub-transport mechanism configured to transport the substrate from thefirst main transport mechanism to the second upper main transportmechanism and to transport the substrate from the second upper maintransport mechanism to the first main transport mechanism, the firstsub-transport mechanism may be configured to be capable of transportingthe substrate from the first main transport mechanism to the secondupper main transport mechanism, and to be capable of transporting thesubstrate from the second upper main transport mechanism to the firstmain transport mechanism, and the second sub-transport mechanism may beconfigured to be capable of transporting the substrate from the firstmain transport mechanism to the second lower main transport mechanism,and to be capable of transporting the substrate from the second lowermain transport mechanism to the first main transport mechanism.

In this case, the substrate is carried into the first lower processingsection and the substrate is carried out from the first lower processingsection by the first lower main transport mechanism in the secondprocessing region. Further, the substrate is carried into the firstupper processing section and the substrate is carried out from the firstupper processing section by the first upper main transport mechanism inthe second processing region. Further, the substrate is transported fromthe first processing region to the second lower main transport mechanismby the first sub-transport mechanism, and the substrate is carried intothe second lower processing section by the second lower main transportmechanism in the third processing region. Further, the substrate iscarried out from the second lower processing section by the second lowermain transport mechanism in the third processing region, and thesubstrate is transported to the first processing region by the firstsub-transport mechanism. Thus, the processing can be concurrentlyperformed on a large number of substrates.

Further, the first sub-transport mechanism can transport the substratefrom the first main transport mechanism to the second upper maintransport mechanism, and can transport the substrate from the secondupper main transport mechanism to the first main transport mechanism.Thus, even when an abnormality occurs in the second sub-transportmechanism, transportation of the substrate between the first maintransport mechanism and the second upper main transport mechanism can beperformed. Further, even when an abnormality occurs in the second lowerprocessing section or the second lower main transport mechanism, thetransportation of the substrate between the first main transportmechanism and the second upper main transport mechanism is performed,whereby the processing for the substrate can be continued.

Further, the second sub-transport mechanism can transport the substratefrom the first main transport mechanism to the second lower maintransport mechanism, and can transport the substrate from the secondlower main transport mechanism to the first main transport mechanism.Thus, even when an abnormality occurs in the first sub-transportmechanism, transportation of the substrate between the first maintransport mechanism and the second lower main transport mechanism can beperformed. Further, even when an abnormality occurs in the second upperprocessing section or the second upper main transport mechanism, thetransportation of the substrate between the first main transportmechanism and the second lower main transport mechanism is performed,whereby the processing for the substrate can be continued.

-   -   (6) The first processing section in the second processing region        and the second processing section in the third processing region        may alternately perform same processing on the substrate.

In this case, the second and third main transport mechanisms can becontrolled by the same software. Thus, the software that controls thesecond and third main transport mechanisms can be simplified.

-   -   (7) A substrate processing apparatus according to another aspect        of the present invention, a substrate processing apparatus        includes first, second and third processing regions, and a        sub-transport region, wherein the second processing region is        arranged between the first processing region and the third        processing region, the first processing region includes a first        main transport mechanism that transports a substrate, the second        processing region includes a processing section that performs        processing on the substrate and a second main transport        mechanism that transports the substrate, the processing section        includes a plurality of processing units, the third processing        region includes a third main transport mechanism that transports        the substrate, the sub-transport region includes a sub-transport        mechanism that transports the substrate, the sub-transport        mechanism is configured to transport the substrate between the        first main transport mechanism and at least one processing unit        of the plurality of processing units, and the second main        transport mechanism is configured to carry in the substrate from        and carry out the substrate to another processing unit of the        plurality of processing units, to receive the substrate from and        transfer the substrate to the first main transport mechanism and        to receive the substrate from and transfer the substrate to the        third main transport mechanism.

In this substrate processing apparatus, the second processing region isarranged between the first processing region and the third processingregion. The substrate is transported to the sub-transport mechanism inthe sub-transport region by the first main transport mechanism in thefirst processing region, and is transported to at least the oneprocessing unit of the plurality of processing units in the processingsection in the second processing region by the sub-transport mechanism.The one processing is performed on the substrate by the one processingunit.

The substrate after the one processing is carried into anotherprocessing unit of the plurality of processing units by the second maintransport mechanism. Another processing is performed on the substrate byanother processing unit. The substrate after another processing iscarried out from another processing unit by the second main transportmechanism, and received and transferred to the third main transportmechanism in the third processing region. Further, the substrate isreceived and transferred to the second main transport mechanism by thethird main transport mechanism, and received and transferred to thefirst main transport mechanism by the second main transport mechanism.

In this case, transportation of the substrate to at least the oneprocessing unit of the plurality of processing units in the processingsection in the second processing region is performed by thesub-transport mechanism. Therefore, the number of transportation stepsby the second main transport mechanism is reduced. Thus, a burden on thesecond main transport mechanism can be reduced. As a result, thethroughput of the substrate processing apparatus can be improved.

(8) The substrate processing apparatus may further include a firstsubstrate platform on which the substrate that is transported betweenthe first main transport mechanism and the sub-transport mechanism istemporarily placed and the substrate that is transported between thesub-transport mechanism and the second main transport mechanism istemporarily placed.

In this case, the substrate is transported between the first maintransport mechanism and the sub-transport mechanism via the firstsubstrate platform. Further, the substrate is transported between thesub-transport mechanism and the second main transport mechanism via thefirst substrate platform. Thus, even when the transport speeds of thefirst main transport mechanism and the sub-transport mechanism aredifferent, the substrate can be reliably transported between the firstmain transport mechanism and the sub-transport mechanism. Further, evenwhen the transport speeds of the sub-transport mechanism and the secondmain transport mechanism are different, the substrate can be reliablytransported between the sub-transport mechanism and the second maintransport mechanism.

(9) The plurality of processing units may include a liquid processingunit that performs processing using a processing liquid and a thermalprocessing unit that performs thermal processing on the substrate, theat least one processing unit may include the thermal processing unit,the second processing region may include a liquid processing region inwhich the liquid processing unit is arranged, a thermal processingregion in which the thermal processing unit is arranged and a maintransport region in which the second main transport mechanism isarranged, the main transport region may be arranged between the liquidprocessing region and the thermal processing region, the sub-transportregion may be provided on an opposite side to the main transport regionwith respect to the thermal processing region, and the first substrateplatform may be arranged between the main transport region and thesub-transport region.

In this case, with a simple configuration, the substrate is transportedto the first liquid processing region and the thermal processing regionby the second main transport mechanism in the main transport region.Thus, the thermal processing can be performed on the substrate as theone processing. Further, the processing using the processing liquid andthe thermal processing can be performed on the substrate as anotherprocessing.

(10) The substrate processing apparatus may further include a secondsubstrate platform on which the substrate that is received andtransferred between the first main transport mechanism and the secondmain transport mechanism is temporarily placed, and a third substrateplatform on which the substrate that is transported between the secondmain transport mechanism and the third main transport mechanism istemporarily placed.

In this case, the substrate is transported between the first maintransport mechanism and the second main transport mechanism via thesecond substrate platform. Further, the substrate is transported betweenthe second main transport mechanism and the third main transportmechanism via the third substrate platform. Thus, even when thetransport speeds of the first main transport mechanism and the secondmain transport mechanism are different, the substrate can be reliablytransported between the first main transport mechanism and the secondmain transport mechanism. Further, even when the transport speeds of thesecond main transport mechanism and the third main transport mechanismare different, the substrate can be reliably transported between thesecond main transport mechanism and the third main transport mechanism.

(11) The first processing region may further include a containerplatform on which a substrate storing container that stores thesubstrate is placed, and the first main transport mechanism may beconfigured to transport the substrate between the substrate storingcontainer placed on the container platform and the second main transportmechanism and to transport the substrate between the substrate storingcontainer placed on the container platform and the sub-transportmechanism.

In this case, the substrate stored in the substrate storing container onthe container platform are sequentially transported to the second maintransport mechanism or the sub-transport mechanism by the first maintransport mechanism. Further, the substrate that is transported to thefirst main transport mechanism by the second main transport mechanism orthe sub-transport mechanism are sequentially stored in the substratestoring container on the container platform. Thus, the processing can beefficiently performed on the plurality of substrates.

(12) The substrate processing apparatus may further include a fourthprocessing region arranged to be adjacent to the third processingregion, wherein the fourth processing region may include a fourth maintransport mechanism that transports the substrate, and the third maintransport mechanism may be configured to transport the substrate amongthe sub-transport mechanism, the second processing section and thefourth main transport mechanism.

In this case, the substrate can be transported among the sub-transportmechanism, the second processing section and the fourth main transportmechanism by the third main transport mechanism.

(13) According to still another aspect of the present invention, asubstrate processing method using a substrate processing apparatus thatincludes first, second and third processing regions and a sub-transportregion, the second processing region being arranged between the firstprocessing region and the third processing region, includes the steps oftransporting a substrate by a first main transport mechanism arranged inthe first processing region, transporting the substrate between thefirst main transport mechanism and a processing section in the secondprocessing region by a second main transport mechanism arranged in thesecond processing region, performing processing on the substrate by theprocessing section, transporting the substrate by a third main transportmechanism arranged in the third processing region, transporting thesubstrate from the first main transport mechanism to the third maintransport mechanism by a sub-transport mechanism arranged in thesub-transport region, and transporting the substrate from the third maintransport mechanism to the first main transport mechanism by thesub-transport mechanism.

In this substrate processing method, the second processing region isarranged between the first processing region and the third processingregion. The one substrate is transported to the second main transportmechanism in the second processing region by the first main transportmechanism in the first processing region, and is transported to theprocessing section by the second main transport mechanism. Theprocessing is performed on the substrate by the processing section. Thesubstrate after the processing is transported to the first maintransport mechanism by the second main transport mechanism.

Further, another substrate is transported to the sub-transport mechanismin the sub-transport region by the first main transport mechanism in thefirst processing region, and is transported to the third main transportmechanism in the third processing region by the sub-transport mechanism.Further, the substrate is transported to the sub-transport mechanism inthe sub-transport region by the third main transport mechanism in thethird processing region, and is transported to the first main transportmechanism in the first processing region by the sub-transport mechanism.

This configuration enables the substrate to be transported between thefirst processing region and the third processing region without the useof the second main transport mechanism in the second processing region.Thus, the throughput in the first or third processing region can beprevented from being restricted by the throughput in the secondprocessing region. Therefore, the throughput in the substrate processingapparatus can be improved.

(14) According to yet another aspect of the present invention, asubstrate processing method using a substrate processing apparatus thatincludes first, second and third processing regions and a sub-transportregion, the second processing region being arranged between the firstprocessing region and the third processing region, includes the steps oftransporting a substrate by a first main transport mechanism arranged inthe first processing region, receiving the substrate from andtransferring the substrate to the first main transport mechanism by asecond main transport mechanism arranged in the second processingregion, performing processing on the substrate by a plurality ofprocessing units arranged in the second processing region, transportingthe substrate between the first main transport mechanism and at leastone processing unit of the plurality of processing units andtransporting the substrate between the at least one processing unit andthe second main transport mechanism by a sub-transport mechanismarranged in the sub-transport region, transporting the substrate betweenthe sub-transport mechanism and another processing unit of the pluralityof processing units by the second main transport mechanism, receivingthe substrate from and transferring the substrate to the third maintransport mechanism by the second main transport mechanism, andtransporting the substrate by a third main transport mechanism arrangedin the third processing region.

In this substrate processing method, the second processing region isarranged between the first processing region and the third processingregion. The substrate is transported to the sub-transport mechanism inthe sub-transport region by the first main transport mechanism in thefirst processing region, and is transported to at least the oneprocessing unit of the plurality of the processing units in theprocessing section in the second processing region by the sub-transportmechanism. The one processing is performed on the substrate by the oneprocessing unit.

The substrate after the one processing is carried into anotherprocessing unit of the plurality of processing units by thesub-transport mechanism and the second main transport mechanism. Anotherprocessing is performed on the substrate by another processing unit. Thesubstrate after another processing is carried out from anotherprocessing unit by the second main-transport mechanism, and is receivedand transferred to the third main transport mechanism in the thirdprocessing region. Further, the substrate is received and transferred tothe second main transport mechanism by the third main transportmechanism and is received and transferred to the first main transportmechanism by the second main transport mechanism.

In this case, the transportation of the substrate to at least the oneprocessing unit of the plurality of processing units in the processingsection in the second processing region is performed by thesub-transport mechanism. Therefore, the number of transportation stepsby the second main transport mechanism is reduced. Thus, a burden on thesecond main transport mechanism can be reduced. As a result, thethroughput of the substrate processing apparatus can be improved.

Other features, elements, characteristics, and advantages of the presentinvention will become more apparent from the following description ofpreferred embodiments of the present invention with reference to theattached drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a schematic plan view of a substrate processing apparatusaccording to a first embodiment of the present invention;

FIG. 2 is a diagram of a first processing section and a secondprocessing section of FIG. 1 as viewed in the −Y direction;

FIG. 3 is a diagram of a thermal processing section of FIG. 1 as viewedin the +Y direction;

FIG. 4 is a diagram of the first processing section, a transport sectionand the thermal processing section of FIG. 1 as viewed in the +Xdirection;

FIG. 5 is a diagram of the transport sections as viewed in the +Ydirection;

FIG. 6 is a perspective view showing a main transport mechanism;

FIG. 7 is a horizontal cross sectional view of the substrate processingapparatus according to the first embodiment;

FIGS. 8A to 8C are diagrams showing the configuration of sub-transportmechanisms;

FIG. 9 is a schematic plan view of the substrate processing apparatusaccording to a second embodiment of the present invention;

FIG. 10 is a horizontal cross sectional view of the substrate processingapparatus according to the second embodiment;

FIG. 11 is a diagram of the first processing section, the secondprocessing section and a cleaning/drying processing section of FIG. 9 asviewed in the −Y direction;

FIG. 12 is a diagram of the thermal processing sections and thecleaning/drying processing section of FIG. 9 as viewed in the +Ydirection;

FIG. 13 is a diagram of the transport sections of FIG. 9 as viewed inthe +Y direction;

FIG. 14 is a diagram showing the inner configuration of acleaning/drying processing block;

FIG. 15 is a horizontal cross sectional view of the substrate processingapparatus according to a third embodiment;

FIG. 16 is a diagram of the first processing section, the secondprocessing section and the cleaning/drying processing section of FIG. 15as viewed in the −Y direction; and

FIG. 17 is a diagram of the thermal processing sections and thecleaning/drying processing section of FIG. 15 as viewed in the +Ydirection.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A substrate processing apparatus and a substrate processing methodaccording to embodiments of the present invention will be describedbelow with reference to the drawings. In the following description, asubstrate refers to a semiconductor substrate, a substrate for a liquidcrystal display, a substrate for a plasma display, a glass substrate fora photomask, a substrate for an optical disc, a substrate for a magneticdisc, a substrate for a magneto-optical disc, a substrate for aphotomask or the like.

In the substrate used in the present embodiment, at least part of thesubstrate has a circular outer periphery. The outer periphery except fora cutout (an orientation flat or a notch) for positioning is circular,for example.

[1] First Embodiment

(1) Configuration of Substrate Processing Apparatus

FIG. 1 is a schematic plan view of the substrate processing apparatusaccording to the first embodiment of the present invention. FIG. 1 andsubsequent given diagrams are accompanied by the arrows that indicate X,Y, and Z directions orthogonal to one another for the clarity of apositional relationship. The X and Y directions are orthogonal to eachother within a horizontal plane, and the Z direction corresponds to avertical direction. Note that the direction toward the arrow is definedas + direction, and the opposite direction thereto is defined as −direction.

As shown in FIG. 1, the substrate processing apparatus 100 includes anindexer block 11 and processing blocks 12, 13. The indexer block 11includes a plurality of carrier platforms 111 and a transport section112. A carrier 113 that stores a plurality of substrates Win multiplestages is placed in each carrier platform 111. While a FOUP (FrontOpening Unified Pod) is used as the carrier 113 in the presentembodiment, the present invention is not limited to this. A SMIF(Standard Mechanical Inter Face) pod, an OC (Open Cassette) that exposesthe stored substrates W to the outside air or the like may be used.

A transport section 112 is provided with a main controller 114 and amain transport mechanism 115. The main controller 114 controls variousconstituent elements of the substrate processing apparatus 100. The maintransport mechanism 115 has a hand 116 for holding the substrate W. Themain transport mechanism 115 holds and transports the substrate W usingthe hand 116. Further, as shown in after-mentioned FIG. 5, an opening119 for receiving and transferring the substrates W between each carrier113 and the main transport mechanism 115 is formed at the transportsection 112.

A main panel PN is provided on a side surface of the transport section112. The main panel PN is connected to the main controller 114. A usercan confirm the processing status of the substrate W in the substrateprocessing apparatus 100 and other information on the main panel PN. Anoperation unit (not shown) made of a keyboard, for example, is providedin the vicinity of the main panel PN. The user can set operationsettings of the substrate processing apparatus 100 and so on byoperating the operation unit.

The processing block 12 includes a first processing section 121, atransport section 122 and a thermal processing section 123. In thepresent embodiment, the first processing section 121 is a coatingprocessing section. The first processing section 121 and the thermalprocessing section 123 are provided to be opposite to each other withthe transport section 122 sandwiched therebetween. A substrate platformPASS1 and after-mentioned substrate platforms PASS2 to PASS4 (FIG. 5),on which the substrates W are to be placed, are provided between thetransport section 122 and the indexer block 11. The transport section122 is provided with a main transport mechanism 127 and anafter-mentioned main transport mechanism 128 (FIG. 5) that transport thesubstrates W.

The processing block 13 includes a second processing section 131, atransport section 132 and a thermal processing section 133. In thepresent embodiment, the second processing section 131 is a coatingprocessing section. The second processing section 131 and the thermalprocessing section 133 are provided to be opposite to each other withthe transport section 132 sandwiched therebetween. A substrate platformPASS5 and after-mentioned substrate platforms PASS6 to PASS8 (FIG. 5),on which the substrates W are to be placed, are provided between thetransport section 132 and the transport section 122. The transportsection 132 is provided with a main transport mechanism 137 and anafter-mentioned main transport mechanism 138 (FIG. 5) that transportsubstrates W.

(2) Configuration of First Processing Section and Second ProcessingSection

FIG. 2 is a diagram of the first processing section 121 and the secondprocessing section 131 of FIG. 1 as viewed in the −Y direction. As shownin FIG. 2, four processing chambers 21, 22, 23, 24 are provided in astack in the first processing section 121. Four processing chambers 31,32, 33, 34 are provided in a stack in the second processing section 131.In the present embodiment, the processing chambers 21 to 24, 31 to 34are coating processing chambers.

A plurality of spin chucks 25, a plurality of cups 27 and a plurality ofprocessing liquid nozzles (not shown) are provided in each processingchamber 21 to 24, 31 to 34. In the present embodiment, the two spinchucks 25 and the two cups 27 are provided in each processing chamber 21to 24, 31 to 34.

When each spin shuck 25 is holding the substrate W, the spin chuck 25 isdriven to be rotated by a driving device (an electric motor, forexample) that is not shown. Each cup 27 is provided to surround the spinchuck 25. A processing liquid is supplied from a processing liquidstorage (not shown) to each processing liquid nozzle through aprocessing liquid pipe. In the present embodiment, the processing liquidis a processing liquid for a resist film (a resist liquid). Theprocessing liquid is discharged from the processing liquid nozzle whenthe spin chuck 25 is being rotated such that the processing liquid isapplied on the rotating substrate W.

As shown in FIGS. 1 and 2, a fluid box 50 is provided in the firstprocessing section 121 to be adjacent to the second processing section131. A fluid box 60 is provided in the second processing section 131 tobe opposite to the first processing section 121. The fluid box 50 andthe fluid box 60 each store fluid related elements used to supply theprocessing liquid to the processing chambers 21 to 24, 31 to 34, anddischarge the liquid and air out of the processing chambers 21 to 24, 31to 34. The fluid related elements include pipes, joints, valves,flowmeters, regulators, pumps, temperature adjusters and the like.

(3) Configuration of Thermal Processing Section

FIG. 3 is a diagram of the thermal processing sections 123, 133 of FIG.1 as viewed in the +Y direction. As shown in FIG. 3, the thermalprocessing section 123 has an upper thermal processing section 301provided above, and a lower thermal processing section 302 providedbelow. In the present embodiment, the upper thermal processing section301 is provided with a plurality of thermal processing units PHP, aplurality of cooling units CP and a plurality of substrate platformsPASS9, PASS10. The lower thermal processing section 302 is provided witha plurality of thermal processing units PHP, a plurality of coolingunits CP and a plurality of substrate platforms PASS11, PASS12.

The substrate platforms PASS9, PASS10 and the cooling units CP arearranged at its lowermost portion of the upper thermal processingsection 301, and the substrate platforms PASS11, PASS12 and the coolingunits CP are arranged at its uppermost portion of the lower thermalprocessing section 302. In each thermal processing unit PHP, heatingprocessing and cooling processing for the substrate W are performed. Ineach cooling unit CP, the cooling processing for the substrate W isperformed.

A local controller LC1 is provided at its uppermost portion of thethermal processing section 123. The local controller LC1 performstemperature control of the thermal processing units PHP and the coolingunits CP in the thermal processing section 123. Further, the localcontroller LC1 controls the operation of the spin chucks 25 of FIG. 2,the supply of the processing liquid to the processing liquid nozzles andthe like. Further, the local controller LC1 controls the operation ofthe main transport mechanism 127 of FIG. 1.

The thermal processing section 133 has an upper thermal processingsection 303 provided above, and a lower thermal processing section 304provided below. In the present embodiment, the upper thermal processingsection 303 is provided with a plurality of thermal processing unitsPHP, a plurality of cooling units CP and a plurality of substrateplatforms PASS13, PASS14. The lower thermal processing section 304 isprovided with a plurality of thermal processing units PHP, a pluralityof cooling units CP and a plurality of substrate platforms PASS15,PASS16.

The substrate platforms PASS13, PASS14 and the cooling units CP arearranged at its lowermost portion of the upper thermal processingsection 303, and the substrate platforms PASS15, PASS16 and the coolingunits CP are arranged at its uppermost portion of the lower thermalprocessing section 304.

A local control LC2 is provided at its uppermost portion of the thermalprocessing section 133. The local controller LC2 performs thetemperature control of the thermal processing units PHP and the coolingunits CP in the thermal processing section 133. Further, the localcontroller LC2 controls the operation of the spin chucks 25 of FIG. 2and the supply of the processing liquid to the processing liquid nozzlesand the like. Further, the local controller LC2 controls the operationof the main transport mechanism 137 of FIG. 1.

A sub-transport chamber 110 is provided between the upper thermalprocessing sections 301, 303 and the lower thermal processing sections302, 304. Two sub-transport mechanisms 117, 118 are provided in thesub-transport chamber 110. The sub-transport mechanisms 117, 118 arecontrolled by the main controller 114 in the indexer block 11. Theconfiguration and the operation of the sub-transport mechanisms 117, 118in the sub-transport chamber 110 will be described below.

The local controllers LC1, LC2 and the main controller 114 control eachconstituent element in accordance with a control program (controlsoftware).

(4) Configuration of Transport Sections

FIG. 4 is a diagram of the first processing section 121, the transportsection 122 and the thermal processing section 123 of FIG. 1 as viewedin the +X direction. FIG. 5 is a diagram of the transport sections 122,132 as viewed in the +Y direction. As shown in FIGS. 4 and 5, thetransport section 122 has an upper transport chamber 125 and a lowertransport chamber 126. As shown in FIG. 5, the transport section 132 hasan upper transport chamber 135 and a lower transport chamber 136.

The main transport mechanism 127 is provided in the upper transportchamber 125, and the main transport mechanism 128 is provided in thelower transport chamber 126. Further, the main transport chamber 137 isprovided in the upper transport chamber 135, and the main transportmechanism 138 is provided in the lower transport chamber 136.

As shown in FIG. 4, the processing chambers 21, 22 and the upper thermalprocessing section 301 are provided to be opposite to each other withthe upper transport chamber 125 sandwiched therebetween, and theprocessing chambers 23, 24 and the lower thermal processing section 302are provided to be opposite to each other with the lower transportchamber 126 sandwiched therebetween. Similarly, the processing chambers31, 32 (FIG. 2) and the upper thermal processing section 303 (FIG. 3)are provided to be opposite to each other with the upper transportchamber 135 (FIG. 5) sandwiched therebetween, and the processingchambers 33, 34 (FIG. 2) and the lower thermal processing section 304(FIG. 3) are provided to be opposite to each other with the lowertransport chamber 136 (FIG. 5) sandwiched therebetween.

As shown in FIG. 5, the substrate platforms PASS1, PASS2 are providedbetween the transport section 112 and the upper transport chamber 125,and the substrate platforms PASS3, PASS4 are provided between thetransport section 112 and the lower transport chamber 126. The substrateplatforms PASS5, PASS6 are provided between the upper transport chamber125 and the upper transport chamber 135, and the substrate platformsPASS7, PASS8 are provided between the lower transport chamber 126 andlower transport chamber 136. In the present embodiment, the substrateplatforms PASS1 to PASS8 do not have to be used depending on a transportroute of the substrate W.

The substrate W that is transported from the indexer block 11 to theprocessing block 12 can be placed on the substrate platform PASS1 andthe substrate platform PASS3, and the substrate W that is transportedfrom the processing block 12 to the indexer block 11 can be placed onthe substrate platform PASS2 and the substrate platform PASS4. Further,the substrate W that is transported from the processing block 12 to theprocessing block 13 can be placed on the substrate platform PASS5 andthe substrate platform PASS7, and the substrate W that is transportedfrom the processing block 13 to the processing block 12 can be placed onthe substrate platform PASS6 and the substrate platform PASS8.

(5) Configuration of Main Transport Mechanisms

Next, the main transport mechanisms 127, 128, 137, 138 will bedescribed. FIG. 6 is a perspective view showing the main transportmechanism 127. As shown in FIG. 6, the main transport mechanism 127includes long-sized guide rails 311, 312. As shown in FIG. 5, the guiderails 311, 312 are arranged to extend in the vertical direction (Zdirection) and to be spaced apart from each other in the X direction inthe upper transport chamber 125. The guide rail 311 is fixed at aposition in close proximity to the side surface close to the transportsection 112 in the X direction. The guide rail 312 is fixed at aposition in close proximity to the side surface far from the transportsection 112 in the X direction.

A long-sized guide rail 313 is provided to extend in a horizontaldirection (X direction) between the guide rail 311 and the guide rail312. The guide rail 313 is attached to the guide rails 311, 312 to bemovable in the vertical direction. A moving member 314 is attached tothe guide rail 313. The moving member 314 is provided to be movable inthe X direction along the guide rail 313.

The rotation member 315 is provided at the upper surface of the movingmember 314 to be rotatable around an axis in the Z direction. A hand H1and a hand H2 for holding the substrates W are attached to the rotationmember 315. The hands H1, H2 are provided to be capable of advancing andretreating with respect to the rotation member 315. The main transportmechanisms 128, 137, 138 have the similar configuration to the maintransport mechanism 127.

Such a configuration as described above enables the hands H1, H2 of themain transport mechanisms 127, 128, 137, 138 to respectively move in theX and Z directions in the upper transport chamber 125, the lowertransport chamber 126, the upper transport chamber 135 and the lowertransport chamber 136, rotate around the axis in the Z direction,advance and retreat.

The main transport mechanism 127 can receive the substrates W from andtransfer the substrates W to the processing chambers 21, 22 (FIG. 2),the substrate platforms PASS1, PASS2, PASS5, PASS6, PASS9, PASS10 (FIGS.3 and 5) and the upper thermal processing section 301 (FIG. 3) using thehands H1, H2. The main transport mechanism 128 can receive thesubstrates W from and transfer the substrates W to the processingchambers 23, 24 (FIG. 2), the substrate platforms PASS3, PASS4, PASS7,PASS8, PASS11, PASS12 (FIGS. 3 and 5) and the lower thermal processingsection 302 (FIG. 3) using the hands H1, H2.

The main transport mechanism 137 can receive the substrates W from andtransfer the substrates W to the processing chambers 31, 32 (FIG. 2),the substrate platforms PASS5, PASS6, PASS13, PASS14 (FIGS. 3 and 5) andthe upper thermal processing section 303 (FIG. 3) using the hands H1,H2. The main transport mechanism 138 can receive the substrates W fromand transfer the substrates W to the processing chambers 33, 34 (FIG.2), the substrate platforms PASS7, PASS8, PASS15, PASS16 (FIG. 5) andthe lower thermal processing section 304 (FIG. 3) using the hands H1,H2.

(6) Sub-Transport Chamber and Sub-Transport Mechanisms

Next, the configuration of the sub-transport chamber 110 and theconfiguration and the operation of the sub-transport mechanisms 117, 118will be described.

FIG. 7 is a horizontal cross sectional view of the substrate processingapparatus 100 according to the first embodiment. As shown in FIG. 7, thelength of each cooling unit CP in the Y direction is shorter than thelength of each thermal processing unit PHP of FIG. 1. The length of thesubstrate platforms PASS9 to PASS16 is substantially equal to the lengthof each cooling unit CP.

As shown in FIGS. 4 and 7, the sub-transport chamber 110 is provided ina space surrounded by the lowermost surface of the plurality of thermalprocessing units PHP in the upper thermal processing sections 301, 303,the uppermost surface of the plurality of the thermal processing unitsPHP in the lower thermal processing sections 302, 304, the back surfacesof the thermal processing sections 123, 133, the back surfaces of theplurality of cooling units CP (surfaces opposite to the transportsection 122) and the back surfaces of the substrate platforms PASS9 toPASS16 (surfaces opposite to the transport section 122). Thesub-transport chamber 110 extends from the side surface of theprocessing block 12 adjacent to the indexer block 11 to the side surfaceof the processing block 13 opposite to the indexer block 11.

In this case, with a simple configuration, the substrate W istransported to the processing chambers 21 to 24 in the first processingsection 121, the upper thermal processing section 301 or the lowerthermal processing section 302 in the thermal processing section 123 bythe main transport mechanisms 127, 128 in the transport section 122.

Further, with a simple configuration, the substrate W is transportedbetween the main transport mechanism 115 and the sub-transport mechanism117, 118, and the substrate W is transported between the sub-transportmechanism 117, 118 and the main transport mechanism 137, 138 in thetransport section 132. Further, with a simple configuration, thesubstrate W is transported to the processing chambers 31 to 34 in thesecond processing section 131, the upper thermal processing section 303or the lower thermal processing section 304 in the thermal processingsection 133 by the main transport mechanism 137, 138.

Thus, the processing can be respectively, independently and concurrentlyperformed on the substrates W in the processing blocks 12, 13.Therefore, it is possible to improve the throughput of the substrateprocessing apparatus 100 without complicating the configuration and thecontrol of the substrate processing apparatus 100.

FIGS. 8A to 8C are diagrams showing the configuration of thesub-transport mechanisms 117, 118. FIGS. 8A, 8B, 8C are diagrams of thesub-transport mechanisms 117, 118 as viewed in the −Z direction, +Ydirection and +X direction, respectively.

As shown in FIGS. 8A to 8C, the sub-transport mechanism 117 haslong-sized guide rails 411, 412. The guide rails 411, 412 extend in thevertical direction (Z direction) and are arranged to be spaced apartfrom each other in the X direction in the sub-transport chamber 110 ofFIG. 3. The guide rail 411 is fixed at a position in close proximity tothe substrate platforms PASS9 to PASS12 at the end adjacent to thetransport section 112 of FIG. 3. The guide rail 412 is fixed at aposition in close proximity to the substrate platforms PASS13 to PASS16at the end opposite to the transport section 112.

A long-sized guide rail 413 is provided between the guide rail 411 andthe guide rail 412 to extend in the horizontal direction (X direction).The guide rail 413 is attached to the guide rails 411, 412 to be movablein the vertical direction. A moving member 414 is attached to the guiderail 413. The moving member 414 is provided to be movable in the Xdirection along the guide rail 413.

A support member 415 is provided on the upper surface of the movingmember 414 to be movable in the vertical direction. Hands H3, H4 forholding the substrates W are attached to the support member 415 to becapable of advancing and retreating in the horizontal direction (Ydirection).

The sub-transport mechanism 118 includes long-sized guide rails 511,512. The guide rails 511, 512 extend in the vertical direction (Zdirection) and are arranged to be spaced apart from each other in the Xdirection in the sub-transport chamber 110 of FIG. 3. The guide rail 511is fixed at a position spaced apart from the guide rail 411 in the Ydirection at the end adjacent to the transport section 112 of FIG. 3.The guide rail 512 is fixed at a position spaced apart from the guiderail 412 in the Y direction at the end opposite to the transport section112.

A long-sized guide rail 513 is provided between the guide rail 511 andthe guide rail 512 to extend in the horizontal direction (X direction).The guide rail 513 is attached to the guide rails 511, 512 to be movablein the vertical direction. The moving member 514 is attached to theguide rail 513. The moving member 514 is provided to be movable in the Xdirection along the guide rail 513.

The support member 515 is provided on the upper surface of the movingmember 514 to be movable in the vertical direction. Hands H3 and H4 forholding the substrates W are attached to the support member 515 to becapable of advancing and retreating in the horizontal direction (Ydirection).

The configuration described above enables the hands H3, H4 of thesub-transport mechanisms 117, 118 to move in the X and Z directions andto advance and retreat in the Y direction in the sub-transport chamber110 of FIG. 3.

The support members 415, 515 may be provided at the moving members 414,514 to be rotatable around an axis in the Z direction, respectively. Inthis case, the hands H3, H4 of the sub-transport mechanisms 117, 118 canbe rotated around the axis in the Z direction.

The hands H3, H4 of the sub-transport mechanisms 117, 118 can move inthe Z direction within a small range by the movement of the supportmembers 415, 515 in the vertical direction. Further, the hands H3, H4 ofthe sub-transport mechanisms 117, 118 can move in the Z direction withina range from the upper end to the lower end in the sub-transport chamber110 by the movement of the guide rails 413, 513 in the verticaldirection. Hereinafter, the movement of the hands H3, H4 in the Zdirection caused by the movement of the support members 415, 515 in thevertical direction is referred to as a normal movement, and the movementof the hands H3, H4 in the Z direction caused by the movement of theguide rails 413, 513 in the vertical direction is referred to as anemergency movement.

The sub-transport mechanism 117 can normally receive the substrate Wfrom and transfer the substrate W to the substrate platforms PASS9,PASS10, PASS13, PASS14 (FIG. 3) by the movement of the hands H3, H4 inthe X direction and the normal movement in the Z direction. Further, thesub-transport mechanism 118 can normally receive the substrate W fromand transfer the substrate W to the substrate platforms PASS11, PASS12,PASS15, PASS16 (FIG. 3) by the movement of the hands H3, H4 in the Xdirection and the normal movement in the Z direction.

When an abnormality such as failure occurs to the sub-transportmechanism 118, the sub-transport mechanism 117 can receive the substrateW from and transfer the substrate W to the substrate platforms PASS9 toPASS16 (FIG. 3) by the movement of the hands H3, H4 in the X directionand the emergency movement in the Z direction. Further, when anabnormality such as failure occurs to the sub-transport mechanism 117,the sub-transport mechanism 118 can receive the substrate W from andtransfer the substrate W to the substrate platform PASS9 to PASS16 (FIG.3) by the movement of the hands H3, H4 in the X direction and theemergency movement in the Z direction.

(7) One Example of Transportation of Substrate in Substrate ProcessingApparatus

(7-1) Schematic Operation

Hereinafter, the substrate W that has not been processed in theprocessing blocks 12, 13 is referred to as an unprocessed substrate W,and the substrate W that has been processed in the processing blocks 12,13 is referred to as a processed substrate.

In the present example, as shown by the one-dot and dash line in FIG. 7,the unprocessed substrate W is transported from the indexer block 11 tothe processing block 12 via the sub-transport chamber 110, and theunprocessed substrate W is transported from the indexer block 11 to theprocessing block 13 via the sub-transport chamber 110. Further, theprocessed substrate W is transported from the processing block 12 to theindexer block 11 via the sub-transport chamber 110, and the processedsubstrate W is transported from the processing block 13 to the indexerblock 11 via the sub-transport chamber 110.

In the present example, the substrate W is transported between the maintransport mechanism 115 and the sub-transport mechanism 117, 118 orbetween the main transport mechanism 115 and the main transportmechanism 127, 128 via the substrate platform PASS9 to PASS12. Thus,even when the time point of transportation by the main transportationmechanism 115, the sub-transport mechanisms 117, 118, and the maintransport mechanisms 127, 128 are different, the substrate W can bereliably transported between the main transport mechanism 115 and thesub-transport mechanism 117, 118 or between the main transport mechanism115 and the main transport mechanism 127, 128.

Similarly, the substrate W is transported between the sub-transportmechanism 117, 118 and the main transport mechanism 137, 138 via thesubstrate platform PASS13 to PASS16. Thus, even when the time point oftransportation by the sub-transport mechanisms 117, 118 and the maintransport mechanisms 137, 138 are different, the substrate W can bereliably transported between the sub-transport mechanism 117, 118 andthe main transport mechanism 137, 138.

While the substrate platforms PASS1 to PASS8 are not used intransportation of the present example, the substrate platforms PASS1 toPASS8 may be used for transporting the substrate W between the indexerblock 11 and the processing block 12.

(7-2) Transportation in Indexer Block

The transportation in the indexer block 11 will be described belowmainly using FIGS. 1, 3 and 5.

The carrier 113 in which the unprocessed substrates W are stored isplaced on the carrier platform 111 in the indexer block 11. The maintransport mechanism 115 takes out the single substrate W from thecarrier 113 and transports the substrate W to the substrate platformPASS9. Thereafter, the main transport mechanism 115 takes out anotherunprocessed single substrate W from the carrier 113 and transports thesubstrate W to the substrate platform PASS11.

When the processed substrate W is placed on the substrate platformPASS10, the main transport mechanism 115 takes out the processedsubstrate W from the substrate platform PASS10 after transporting theunprocessed substrate W to the substrate platform PASS9. Then, maintransport mechanism 115 transports the processed substrate W to thecarrier 113.

Similarly, when the processed substrate W is placed on the substrateplatform PASS12, the main transport mechanism 115 takes out theprocessed substrate W from the substrate platform PASS12 aftertransporting the unprocessed substrate W to the substrate platformPASS11. Then, the transport mechanism 115 transports the processedsubstrate W to the carrier 113.

In this case, the substrate W stored in the carrier 113 of the carrierplatform 111 is sequentially transported to the substrate platformsPASS9, PASS11 by the main transport mechanism 115. Further, thesubstrates W placed on the substrate platforms PASS10, PASS12 aresequentially stored in the carrier 113 on the carrier platform 111.Thus, the plurality of substrates W can be efficiently processed.

(7-3) Transportation in Sub-Transport Chamber

Next, one example of transportation in the sub-transport chamber 110will be described mainly using FIGS. 3, 4 and 7.

The sub-transport mechanism 117 takes out the unprocessed substrate Wplaced on the substrate platform PASS9 using the hand H3. Further, thesub-transport mechanism 117 places the processed substrate W held by thehand H4 on the substrate platform PASS10.

Then, the sub-transport mechanism 117 moves the hands H3, H4 frompositions opposite to the substrate platforms PASS9, PASS10 to positionsopposite to the substrate platforms PASS13, PASS14. The sub-transportmechanism 117 places the unprocessed substrate W held by the hand H3 onthe substrate platform PASS13. Further, the sub-transport mechanism 117takes out the processed substrate W from the substrate platform PASS14using the hand H4. Thereafter, the sub-transport mechanism 117 moves thehands H3, H4 from the positions opposite to the substrate platformsPASS13, PASS14 to the positions opposite to the substrate platformsPASS9, PASS10, and transports the substrate W held by the hand H4 to thesubstrate platform PASS10.

When the sub-transport mechanism 117 is transporting the substrate Wbetween the substrate platform PASS9, PASS10 and the substrate platformPASS13, PASS14, the unprocessed substrate W is placed on the substrateplatform PASS9 by the main transport mechanism 115 in the indexer block11 and is taken out by the main transport mechanism 127 in theprocessing block 12. Further, the processed substrate W is placed on thesubstrate platform PASS10 by the main transport mechanism 127 in theprocessing block 12 and is taken out by the main transport mechanism 115in the indexer block 11.

The sub-transport mechanism 118 takes out the unprocessed substrate Wplaced on the substrate platform PASS11 using the hand H3. Further, thesub-transport mechanism 118 places the processed substrate W held by thehand H4 on the substrate platform PASS12.

Next, the sub-transport mechanism 118 moves the hands H3, H4 frompositions opposite to the substrate platforms PASS11, PASS12 topositions opposite to the substrate platforms PASS15, PASS16. Thesub-transport mechanism 118 places the unprocessed substrate W held bythe hand H3 on the substrate platform PASS15. Further, the sub-transportmechanism 118 takes out the processed substrate W from the substrateplatform PASS16 using the hand H4. Thereafter, the sub-transportmechanism 118 moves the hands H3, H4 from the positions opposite to thesubstrate platforms PASS15, PASS16 to the positions opposite to thesubstrate platforms PASS11, PASS12, and transports the substrate W heldby the hand H4 to the substrate platform PASS12.

When the sub-transport mechanism 118 is transporting the substrate Wbetween the substrate platform PASS11, PASS12 and the substrate platformPASS15, PASS16, the unprocessed substrate W is placed on the substrateplatform PASS11 by the main transport mechanism 115 in the indexer block11 and is taken out by the main transport mechanism 128 in theprocessing block 12. Further, the processed substrate W is placed on thesubstrate platform PASS12 by the main transport mechanism 128 in theprocessing block 12 and taken out by the main transport mechanism 115 inthe indexer block 11.

(7-4) Transportation in Processing Block 12

The transportation in the processing block 12 will be described mainlyusing FIGS. 1, 2, 3 and 5.

The main transport mechanism 127 takes out the unprocessed substrate Wplaced on the substrate platform PASS9 using the hand H1. Further, themain transport mechanism 127 places the processed substrate W held bythe hand H2 on the substrate platform PASS10. The substrate W placed onthe substrate platform PASS10 from the main transport mechanism 127 isthe substrate W after the resist film formation.

Next, the main transport mechanism 127 takes out the substrate W afterthe cooling processing from the one cooling unit CP in the upper thermalprocessing section 301 using the hand H2. Further, the main transportmechanism 127 carries in the unprocessed substrate W held by the hand H1to the cooling unit CP. In the cooling unit CP, the substrate W iscooled to a temperature suitable for the resist film formationprocessing.

Then, the main transport mechanism 127 takes out the substrate W afterthe resist film formation from the spin chuck 25 in the processingchamber 21 or the processing chamber 22 using the hand H1. Further, themain transport mechanism 127 places the substrate W after the coolingprocessing held by the hand H2 on the spin chuck 25. In the processingchamber 21, 22, the resist film is formed on the substrate W.

Then, the main transport mechanism 127 takes out the substrate W afterthe thermal processing from the one thermal processing unit PHP in theupper thermal processing section 301 using the hand H2. Further, themain transport mechanism 127 carries in the substrate W after thecooling processing held by the hand H1 to the thermal processing unitPHP. In the thermal processing unit PHP, the heating processing and thecooling processing for the substrate W are successively performed.

The main transport mechanism 127 transports the processed substrate Wthat has been taken out from the thermal processing unit PHP to thesubstrate platform PASS10.

Similarly, the main transport mechanism 128 in the lower transportchamber 126 sequentially transports the substrate W using the hands H1,H2 among the substrate platform PASS11, the one cooling unit CP in thelower thermal processing section 302, the processing chamber 23 or theprocessing chamber 24, the one thermal processing unit PHP and thesubstrate platform PASS12. Thus, the substrate W is cooled to atemperature suitable for the resist film formation, the resist film isformed on the substrate W and the heating processing and the coolingprocessing are performed on the substrate W. The processed substrate Wis transported to the substrate platform PASS12.

(7-5) Transportation in Processing Block 13

The transportation in the processing block 13 will be described mainlyusing FIGS. 1, 2, 3 and 5.

The main transport mechanism 137 in the upper transport chamber 135sequentially transports the substrate W among the substrate platformPASS13, the one cooling unit CP in the upper thermal processing section303, the processing chamber 31 or the processing chamber 32, the onethermal processing unit PHP and the substrate platform PASS14 using thehands H1, H2. Thus, the substrate W is cooled to a temperature suitablefor the resist film formation, the resist film is formed on thesubstrate W, and the heating processing and the cooling processing areperformed on the substrate W. The processed substrate W is transportedto the substrate platform PASS14.

The main transport mechanism 138 in the lower transport chamber 136sequentially transports the substrate W among the substrate platformPASS15, the one cooling unit CP in the lower thermal processing section304, the processing chamber 33 or the processing chamber 34, the onethermal processing unit PHP and the substrate platform PASS16 using thehands H1, H2. Thus, the substrate W is cooled to a temperature suitablefor the resist film formation processing, the resist film is formed onthe substrate W, and the heating processing and the cooling processingare performed on the substrate W. The processed substrate W istransported to the substrate platform PASS16.

(7-6) Transportation in Sub-Transport Chamber at the Time of Abnormality

Next, the transportation at the time of abnormality will be describedmainly using FIG. 3.

When an abnormality such as a failure occurs to the sub-transportmechanism 118, the sub-transport mechanism 117 transports the substrateW between the substrate platform PASS9, PASS10 and the substrateplatform PASS13, PASS14, and transports the substrate W between thesubstrate platform PASS11, PASS12 and the substrate platform PASS15,PASS16 by the movement in the X direction and an emergency movement inthe Z direction of the hands H3, H4.

Further, when an abnormality such as a failure occurs to any one of themain transport mechanisms 127, 128, 137, 138 or any one of theprocessing blocks 12, 13, the sub-transport mechanism 117 performs themovement in the X direction and the emergency movement in the Zdirection of the hands H3, H4. Thus, the sub-transport mechanism 117 cantransport the substrate W between the substrate platform PASS9, PASS10and the substrate platform PASS15, PASS16, and transports the substrateW between the substrate platform PASS11, PASS12 and the substrateplatform PASS13, PASS14. As a result, even when an abnormality such as afailure occurs to any one of the main transport mechanisms 127, 128,137, 138 or any one of the processing blocks 12, 13, the processing forthe substrate W can continue.

Similarly, when an abnormality such as a failure occurs to thesub-transport mechanism 117, the sub-transport mechanism 118 transportsthe substrate W between the substrate platform PASS9, PASS10 and thesubstrate platform PASS13, PASS14, and transports the substrate Wbetween the substrate platform PASS11, PASS12 and the substrate platformPASS15, PASS16 by the movement in the X direction and the emergencymovement in the Z direction of the hands H3, H4.

Further, when an abnormality such as a failure occurs to any one of themain transport mechanisms 127, 128, 137, 138 or any one of theprocessing blocks 12, 13, the sub-transport mechanism 118 performs themovement in the X direction and the emergency movement in the Zdirection of the hands H3, H4. Thus, the sub-transport mechanism 118 cantransport the substrate W between the substrate platform PASS9, PASS10and the substrate platform PASS15, PASS16, and transports the substrateW between the substrate platform PASS11, PASS12 and the substrateplatform PASS13, PASS14. As a result, when an abnormality such as afailure occurs to any one of the main transport mechanisms 127, 128,137, 138 or any one of the processing blocks 12, 13, the processing forthe substrate W can continue.

(8) Effects

In the substrate processing apparatus 100 according to the presentembodiment, the resist film formation processing is performed on thesubstrates W by the processing blocks 12, 13. This configuration enablesthe transportation of the substrate W between the indexer block 11 andthe processing block 13 without the use of the main transport mechanisms127, 128 in the processing block 12. Thus, the throughput in the indexerblock 11 or the processing block 13 can be prevented from beingrestricted by the throughput in the processing block 12. Therefore, thethroughput of the substrate processing apparatus 100 can be improved.

Further, the above-mentioned configuration enables the main transportmechanisms 127, 128 and the main transport mechanisms 137, 138 toperform the same or similar transportation. Thus, it is possible toprevent the control of transportation of the substrates W by the maintransport mechanisms 127, 128 and the main transport mechanisms 137, 138from being complicated. Therefore, software that controls the maintransport mechanisms 127, 128 and the main transport mechanisms 137, 138can be simplified.

[2] Second Embodiment

(1) Configuration of Substrate Processing Apparatus

As for the substrate processing apparatus according to the secondembodiment, difference from the substrate processing apparatus 100according to the first embodiment will be described. FIG. 9 is aschematic plan view of the substrate processing apparatus according tothe second embodiment of the present invention. FIG. 10 is a horizontalcross sectional view of the substrate processing apparatus 100 accordingto the second embodiment. In the present embodiment, the configurationof the processing block 13 is similar to the configuration of theprocessing block 13 in the first embodiment except for that the secondprocessing section 131 is a development processing section.

As shown in FIGS. 9 and 10, the substrate processing apparatus 100further includes a cleaning/drying processing block 14A and acarry-in/carry-out block 14B. An interface block 14 is constituted bythe cleaning/drying processing block 14A and the carry-in/carry-outblock 14B. An exposure device 15 is arranged to be adjacent to thecarry-in/carry-out block 14B.

The cleaning/drying processing block 14A includes cleaning/dryingprocessing sections 161, 162 and a transport section 163. Thecleaning/drying processing sections 161, 162 are provided to be oppositeto each other with the transport section 163 sandwiched therebetween.Main transport mechanisms 141, 142 are provided in the transport section163. A placement/buffer section P-BF1 and an after-mentionedplacement/buffer section P-BF2 (FIG. 13) are provided between thetransport section 163 and the transport section 132. Theplacement/buffer sections P-BF1, P-BF2 are configured to be capable ofstoring the plurality of substrates W.

Further, a substrate platform PASS17 and after-mentionedplacement/cooling platforms P-CP (FIG. 13) are provided between the maintransport mechanisms 141, 142 to be adjacent to the carry-in/carry-outblock 14B. Each placement/cooling platform P-CP has a function ofcooling the substrates W (a cooling plate, for example). The substrate Wis cooled to a temperature suitable for exposure processing in theplacement/cooling platform P-CP.

The main transport mechanism 146 is provided in the carry-in/carry-outblock 14B. The main transport mechanism 146 carries in the substrate Wto and carries out the substrate W from the exposure device 15. Theexposure device 15 is provided with a substrate inlet 15 a for carryingin the substrate W and a substrate outlet 15 b for carrying out thesubstrate W. Note that, the substrate inlet 15 a and the substrateoutlet 15 b of the exposure device 15 may be arranged to be adjacent toeach other in a horizontal direction or may be arranged one above theother.

Accordingly, only the carry-in/carry-out block 14B is moved while thecleaning/drying processing block 14A is not moved at the time of themaintenance operation of the cleaning/drying processing block 14A, thecarry-in/carry-out block 14B and the exposure device 15, thussignificantly reducing the labor of workers and working time.

(2) Configuration of First Processing Section and Second ProcessingSection

FIG. 11 is a diagram of the first processing section 121, the secondprocessing section 131 and the cleaning/drying processing section 161 ofFIG. 9 as viewed in the −Y direction. In the present embodiment, theprocessing chambers 31 to 34 are development processing chambers. Asshown in FIG. 11, each processing chamber 31 to 34 is provided with aplurality of spin chucks 35, a plurality of cups 37 and a plurality ofdevelopment liquid nozzles (not shown). In the present embodiment, thethree spin chucks 35 and the three cups 37 are provided in eachprocessing chamber 31 to 34.

Each spin chuck 35 is driven to be rotated by a driving device (anelectric motor, for example) while holding the substrate W. The cup 37is provided to surround the spin chuck 35. A development liquid isdischarged from the development liquid nozzle as the processing liquidwhile the spin chuck 35 is rotated, whereby the development liquid issupplied to the rotating substrate W. Thus, the development processingfor the substrate W is performed.

A plurality (four in this example) of cleaning/drying processing unitsSD1 are provided in the cleaning/drying section 161. In eachcleaning/drying processing unit SD1, cleaning and drying processing forthe substrate W before the exposure processing is performed. In thecleaning/drying processing unit SD1, polishing processing may beperformed on the back surface of the substrate W and the end of thesubstrate W (a bevel portion) using a brush and the like. Here, the backsurface of the substrate W refers to a surface opposite to the surfaceof the substrate W on which various patterns such as a circuit patternare to be formed.

(3) Configuration of Thermal Processing Section

FIG. 12 is a diagram of the thermal processing sections 123, 133 and thecleaning/drying processing section 162 of FIG. 9 as viewed in the +Ydirection. As shown in FIG. 12, in the present embodiment, an edgeexposure unit EEW is further provided in the upper thermal processingsection 303. Further, an edge exposure unit EEW is further provided inthe lower thermal processing section 304.

In the edge exposure unit EEW, exposure processing for the peripheraledge of the substrate W (edge exposure processing) is performed. Theedge exposure processing is performed on the substrate W such that theresist film on the peripheral edge of the substrate W is removed at thetime of the subsequent development processing. Thus, when the peripheraledge of the substrate W comes into contact with another portion afterthe development processing, the resist film on the peripheral edge ofthe substrate W is prevented from detaching and becoming particles.

A plurality (five in this example) of cleaning/drying processing unitsSD2 are provided in the cleaning/drying processing section 162. In eachcleaning/drying processing unit SD2, the cleaning and drying processingfor the substrate W after the exposure processing are performed.

(4) Configuration of Transport Sections

FIG. 13 is a diagram of the transport sections 122, 132, 163 of FIG. 9as viewed in the +Y direction. As shown in FIG. 13, the placement/buffersection P-BF1 is provided between the upper transport chamber 135 andthe transport section 163, and the placement/buffer section P-BF2 isprovided between the lower transport chamber 136 and the transportsection 163. The substrate platform PASS17 and the plurality ofplacement/cooling platforms P-CP are provided in the transport section163 to be adjacent to the carry-in/carry-out block 14B.

The placement/buffer section P-BF1 is configured such that thesubstrates W can be carried in and carried out by the main transportmechanism 137 and the main transport mechanisms 141, 142 (FIG. 9). Theplacement/buffer section P-BF2 is configured such that the substrates Wcan be carried in and carried out by the main transport mechanism 138and the main transport mechanisms 141, 142 (FIG. 9). The substrateplatform PASS17 and the placement/cooling platforms P-CP are configuredsuch that the substrates W can be carried in and carried out by the maintransport mechanisms 141, 142 (FIG. 9) and the main transport mechanism146.

While the only one substrate platform PASS17 is provided in the exampleof FIG. 13, the plurality of substrate platforms PASS17 may be providedone above the other. In this case, the plurality of substrate platformsPASS17 may be used as buffer sections on which the substrates W aretemporarily placed.

The substrate W that is transported from the processing block 13 to thecleaning/drying block 14A is placed in the placement/buffer sectionP-BF1, P-BF2, the substrate W that is transported from thecleaning/drying processing block 14A to the carry-in/carry-out block 14Bare placed on the placement/cooling platform P-CP, and the substrate Wthat is transported from the carry-in/carry-out block 14B to thecleaning/drying processing block 14A is placed on the substrate platformPASS17. The main transport mechanism 146 in the carry-in/carry-out block14B has hands H9, H10 for holding the substrates W.

(5) Configuration of Cleaning/Drying Processing Block

FIG. 14 is a diagram showing the internal configuration of thecleaning/drying processing block 14A. FIG. 14 is a diagram of thecleaning/drying processing block 14A as viewed in the −X direction. Asshown in FIG. 14, the main transport mechanism 141 has hands H5, H6 forholding the substrates W, and the main transport mechanism 142 has handsH7, H8 for holding the substrates W.

The cleaning/drying processing units SD1 are provided in a stack on the+Y side of the main transport mechanism 141, and the cleaning/dryingprocessing units SD2 are provided in a stack on the −Y side of the maintransport mechanism 142. The placement/buffer sections P-BF1, P-BF2 areprovided one above the other on the −X side between the main transportmechanisms 141, 142. Further, the thermal processing units PHP of theupper thermal processing section 303 and the thermal processing unitsPHP of the lower thermal processing section 304 are configured such thatthe substrates W can be carried in from the cleaning/drying processingblock 14A.

(6) One Example of Transportation of Substrate in Substrate ProcessingApparatus

(6-1) Schematic Operation

As shown by the one-dot and dash line in FIG. 10, the unprocessedsubstrate W is transported from the indexer block 11 to the transportsection 122 in the processing block 12 via the substrate platform PASS1,PASS3, and the substrate W on which the resist films has been formed inthe processing block 12 is transported to the indexer block 11 via thesubstrate platform PASS2, PASS4.

Further, the substrate W on which the resist film has been formed istransported from the indexer block 11 to the transport section 132 inthe processing block 13 via the sub-transport chamber 110 and is furthertransported to the interface block 14 via the placement/buffer sectionP-BF1, P-BF2. The substrate W that has been processed in the interfaceblock 14 is carried into the exposure device 15, and the substrate Wafter the exposure processing by the exposure device 15 is carried outto the interface block 14. The substrate W that has been processed inthe interface block 14 is transported to the transport section 132 viathe thermal processing unit PHP in the upper thermal processing section303 or the lower thermal processing section 304 in the processing block13. The substrate W on which the development processing has beenperformed in the processing block 13 is transported to the indexer block11 via the sub-transport chamber 110.

(6-2) Transportation in Indexer Block

The operation of the indexer block 11 will be described below mainlyusing FIGS. 9, 12 and 13. In the present embodiment, the unprocessedsubstrates W are stored in part of the plurality of carriers 113, andthe substrates Won which the resist films are formed are stored in theother carriers 113.

The main transport mechanism 115 in the present embodiment takes out thesingle unprocessed substrate W from the carrier 113, and transports thesubstrate W to the substrate platform PASS1. Thereafter, the maintransport mechanism 115 takes out another unprocessed substrate W fromthe carrier 113 and transports the substrate W to the substrate platformPASS3.

When the substrate W after the resist film formation is placed on thesubstrate platform PASS2, the main transport mechanism 115 takes out thesubstrate W after the resist film formation from the substrate platformPASS2 after transporting the unprocessed substrate W to the substrateplatform PASS1. Then, the main transport mechanism 115 transports thesubstrate W after the resist film formation to the carrier 113.

Similarly, when the substrate W after the resist film formation isplaced on the substrate platform PASS4, the main transport mechanism 115takes out the substrate W after the resist film formation from thesubstrate platform PASS4 after transporting the unprocessed substrate Wto the substrate platform PASS3. Then, the main transport mechanism 115transports the substrate W after the resist film formation to thecarrier 113.

Further, the main transport mechanism 115 transports the substrate W onwhich the resist film is formed from the carrier 113 to the substrateplatform PASS9, PASS11. Further, the main transport mechanism 115 takesout the substrate W after the development processing from the substrateplatform PASS10, PASS12.

(6-3) Transportation in Sub-Transport Chamber

Next, one example of the transportation in the sub-transport chamber 110will be described mainly using FIGS. 9, 10 and 13. The operation of thesub-transport mechanisms 117, 118 in the present embodiment is similarto the operation of the sub-transport mechanisms 117, 118 in the firstembodiment except for the following point.

In the present embodiment, all the substrates W placed on the substrateplatform PASS9 are transported to the substrate platform PASS13 by thesub-transport mechanism 117. Further, all the substrates W placed on thesubstrate platform PASS11 are transported to the substrate platformPASS15 by the sub-transport mechanism 118.

(6-4) Transportation in Processing Block 12

The operation of the processing block 12 will be described mainly usingFIGS. 11 to 13. The operation of the processing block 12 in the presentembodiment is similar to the operation of the processing block 12according to the first embodiment except for the following point. Theresist film formation processing is performed on the plurality ofsubstrates W in the processing block 12.

The main transport mechanism 127 takes out the unprocessed substrate Wfrom the substrate platform PASS1 not the substrate platform PASS9.Further, the main transport mechanism 127 transports the processedsubstrate W to the substrate platform PASS2 not to the substrateplatform PASS10. The main transport mechanism 128 takes out theunprocessed substrate W from the substrate platform PASS3 not from thesubstrate platform PASS11. Further, the main transport mechanism 128transports the processed substrate W to the substrate platform PASS4 notto the substrate platform PASS12.

(6-5) Transportation in Processing Block 13

The operation of the processing block 13 will be described mainly usingFIGS. 11 to 13.

The main transport mechanism 137 in the upper transport chamber 135sequentially transports the substrate W on which the resist film isformed among the substrate platform PASS13, the edge exposure unit EEWin the upper thermal processing section 303 and the placement/buffersection P-BF1 using the hands H1, H2. Thus, the edge exposure processingis performed on the substrate W, and the substrate W after the edgeexposure processing is transported to the placement/buffer sectionP-BF1.

Further, the main transport mechanism 137 sequentially transports thesubstrate W after the exposure processing by the exposure device 15among the one thermal processing unit PHP, the one cooling unit CP, theprocessing chamber 31 or the processing chamber 32, another thermalprocessing unit PHP and the substrate platform PASS14 in the upperthermal processing section 303 using the hands H1, H2. Thus, postexposure bake (PEB) processing, the cooling processing, the developmentprocessing and the heating processing are sequentially performed on thesubstrate W. The substrate W after the development processing istransported to the substrate platform PASS14.

Similarly, the main transport mechanism 138 in the lower transportchamber 136 transports the substrate W on which the resist film isformed among the substrate platform PASS15, the edge exposure unit EEWin the lower thermal processing section 304 and the placement/buffersection P-BF2 using the hands H1, H2. Thus, the edge exposure processingis performed on the substrate W, and the substrate W after the edgeexposure processing is transported to the placement/buffer sectionP-BF2.

Further, the main transport mechanism 138 sequentially transports thesubstrate W after the exposure processing by the exposure device 15among the one thermal processing unit PHP, the one cooling unit CP, theprocessing chamber 33 or the processing chamber 34, another thermalprocessing unit PHP and the substrate platform PASS16 in the lowerthermal processing section 304 using the hands H1, H2. Thus, the PEBprocessing, the cooling processing, the development processing and theheating processing are sequentially performed on the substrate W. Thesubstrate W after the development processing is transported to thesubstrate platform PASS16.

In a case in which the development processing can be appropriatelyperformed, while the cooling processing for the substrate W is performedin the cooling unit CP before the development processing for thesubstrate W is performed in the processing chamber 31 to 34 in theexample described above, the cooling processing for the substrate W doesnot have to be performed in the cooling unit CP before the developmentprocessing.

(6-6) Transportation in Cleaning/Drying Processing Block andCarry-In/Carry-Out Block

The operation of the cleaning/drying processing block 14A and thecarry-in/carry-out block 14B will be described below mainly using FIGS.13 and 14.

In the cleaning/drying processing block 14A, the main transportmechanism 141 sequentially transports the substrate W after the edgeexposure processing among the placement/buffer section P-BF1, the onecleaning/drying processing unit SD1 in the cleaning/drying section 161and the placement/cooling platform P-CP using the hands H5, H6.Similarly, the main transport mechanism 141 sequentially transports thesubstrate W among the placement/buffer section P-BF2, the onecleaning/drying processing unit SD1 in the cleaning/drying processingsection 161 and the placement/cooling platform P-CP using the hands H5,H6.

Thus, the main transport mechanism 141 alternately transports thesubstrates W after the edge exposure processing placed on theplacement/buffer sections P-BF1, P-BF2 to the placement/coolingplatforms P-CP via the cleaning/drying processing section 161 usinghands H5, H6. Thus, the substrates W are cleaned and dried, and placedon the placement/cooling platforms P-CP. In the placement/coolingplatforms P-CP, the substrates W are cooled to a temperature suitablefor the exposure processing in the exposure device 15 (FIG. 9).

The main transport mechanism 142 transports the substrate W after theexposure processing by the exposure device 15 among the substrateplatform PASS17, the one cleaning/drying processing unit SD2 in thecleaning/drying processing section 162 and the thermal processing unitPHP in the upper thermal processing section 303 (FIG. 12) using thehands H7, H8. Similarly, the main transport mechanism 142 transports thesubstrate W after the exposure processing by the exposure device 15among the substrate platform PASS17, the one cleaning/drying processingunit SD2 in the cleaning/drying processing section 162 and the thermalprocessing unit PHP in the lower thermal processing section 304 (FIG.12) using the hands H7, H8.

Thus, the main transport mechanism 142 alternately transports thesubstrate W after the exposure processing placed on the substrateplatform PASS17 using hands H7, H8 to the upper thermal processingsection 303 and the lower thermal processing section 304 via thecleaning/drying processing section 162. Thus, the substrate W is cleanedand dried, and the PEB processing is performed in the thermal processingunit PHP in the upper thermal processing section 303 or the lowerthermal processing section 304.

In the carry-in/carry-out block 14B, the main transport mechanism 146takes out the substrate W placed on the placement/cooling platform P-CPusing the hand H9, and transports the substrate W to the substrate inlet15 a of the exposure device 15. Further, the main transport mechanism146 takes out the substrate W after the exposure processing from thesubstrate outlet 15 b of the exposure device 15 using the hand H10, andtransports the substrate W to the substrate platform PASS17.

When the exposure device 15 cannot accept the substrate W, the substrateW after the cleaning and drying processing is temporarily stored in theplacement/buffer section P-BF1, P-BF2 by the main transport mechanism141. Further, when the processing chambers 31 to 34 (FIG. 10) in theprocessing block 13 cannot accept the substrate W after the exposureprocessing, the substrate W after the PEB processing is temporarilystored in the placement/buffer section P-BF1, P-BF2 by the maintransport mechanism 137, 138.

Further, when the substrate W is not normally transported to theplacement/buffer sections P-BF1, P-BF2 due to a failure and the like inthe processing block 13, the transportation of the substrate W from theplacement/buffer sections P-BF1, P-BF2 by the main transport mechanism141 may be temporarily stopped until the transportation of the substrateW returns to normal.

(7) Effects

In the substrate processing apparatus 100 according to the presentembodiment, the resist film formation processing is performed on thesubstrate W by the processing block 12, and the development processingis performed on another substrate W by the processing block 13. Thisconfiguration enables the transportation of the substrate W between theindexer block 11 and the processing block 13 without the use of the maintransport mechanism 127, 128 in the processing block 12. Thus, thethroughput in the indexer block 11 or the processing block 13 can beprevented from being restricted by the throughput in the processingblock 12. Therefore, the throughput of the substrate processingapparatus 100 can be improved.

[3] Third Embodiment

(1) Configuration of Substrate Processing Apparatus

As for the substrate processing apparatus according to the thirdembodiment, difference from the substrate processing apparatus 100according to the second embodiment will be described. FIG. 15 is ahorizontal cross sectional view of the substrate processing apparatus100 according to the third embodiment. FIG. 16 is a diagram of the firstprocessing section 121, the second processing section 131 and thecleaning/drying processing section 161 of FIG. 15 as viewed in the −Ydirection. FIG. 17 is a diagram of the thermal processing sections 123,133 and the cleaning/drying processing section 162 of FIG. 15 as viewedin the +Y direction. In the present embodiment, the processing chambers21 to 24, 32, 34 are the coating processing chambers, and the processingchambers 31, 33 are the development processing chambers.

As shown in FIG. 16, the plurality of spin chucks 25, the plurality ofcups 27 and the plurality of processing liquid nozzles (not shown) areprovided in each processing chamber 21 to 24, 32, 34. In the presentembodiment, the processing liquid nozzles of the processing chambers 22,24 discharge a processing liquid for the anti-reflection film. Theprocessing liquid nozzles of the processing chambers 21, 23 dischargethe processing liquid for the resist film (a resist liquid). Theprocessing liquid nozzles of the processing chambers 32, 34 discharge aprocessing liquid for the resist cover film.

The plurality of spin chucks 35, the plurality of cups 37 and theplurality of development liquid nozzles (not shown) are provided in eachprocessing chamber 31, 33. In the present embodiment, the two spinchucks 25 and the two cups 27 are provided in each processing chamber 21to 24, 32, 34. The three spin chucks 35 and the three cups 37 areprovided in each processing chamber 31, 33.

As shown in FIG. 17, in the present embodiment, a plurality of adhesionreinforcement processing units PAHP are further provided in the upperthermal processing section 301. Further, a plurality of adhesionreinforcement processing units PAHP are further provided in the lowerthermal processing section 302.

In the adhesion reinforcement processing unit PAHP, the adhesionreinforcement processing for improving adhesion between the substrate Wand the anti-reflection film is performed. Specifically, in the adhesionreinforcement processing unit PAHP, an adhesion agent such as HMDS(Hexamethyldisilazane) is applied to the substrate W, and the heatingprocessing is performed on the substrate W.

The configuration of the upper thermal processing section 303 in thepresent embodiment is similar to the configuration of the upper thermalprocessing section 303 in the second embodiment. Further, theconfiguration of the lower thermal processing section 304 in the presentembodiment is similar to the configuration of the lower thermalprocessing section 304 in the second embodiment.

(2) One Example of Transportation of Substrate in Substrate ProcessingApparatus

(2-1) Schematic Operation

As shown by the one-dot and dash arrow in FIG. 15, the unprocessedsubstrate W is transported from the indexer block 11 to the adhesionreinforcement processing unit PAHP in the processing block 12 via thesub-transport chamber 110 in the present example. The substrate Wprocessed by the adhesion reinforcement processing unit PAHP istransported to the transport section 122 in the processing block 12 viathe sub-transport chamber 110. The substrate W on which theanti-reflection film and the resist film are formed in the processingblock 12 is transported to the transport section 132 in the processingblock 13 via the substrate platform PASS5, PASS7. The substrate Wonwhich the resist cover film is formed in the processing block 13 istransported to the interface block 14 via the placement/buffer sectionP-BF1, P-BF2. The substrate W processed in the interface block 14 iscarried into the exposure device 15, and the substrate W after theexposure processing by the exposure device 15 is carried out to theinterface block 14.

The substrate W processed in the interface block 14 is transported tothe transport section 132 via the thermal processing unit PHP in theupper thermal processing section 303 or the lower thermal processingunit 304 in the processing block 13. The substrate W on which thedevelopment processing is performed in the processing block 13 istransported to the indexer block 11 via the substrate platform PASSE,PASSE, the transport section 122 in the processing block 12 and thesubstrate platform PASS2, PASS4.

In the present example, the substrate W is transported between the maintransport mechanism 115 and the sub-transport mechanism 117, 118 via thesubstrate platform PASS9, PASS11. Thus, even when the time points oftransportation of the main transport mechanism 115 and the sub-transportmechanisms 117, 118 are different, the substrate W can be reliablytransported between the main transport mechanism 115 and thesub-transport mechanism 117, 118.

Further, the substrate W is transported between the main transportmechanism 127, 128 and the main transport mechanism 137, 138 via thesubstrate platform PASS5 to PASS8. Thus, even when the time points oftransportation of the main transport mechanisms 127, 128 and the maintransport mechanisms 137, 138 are different, the substrate W can bereliably transported between the main transport mechanism 127, 128 andthe main transport mechanism 137, 138.

Further, the substrate W is transported between the main transportmechanism 127, 128 and the main transport mechanism 115 via thesubstrate platform PASS2, PASS4. Thus, even when the time points oftransportation of the main transport mechanisms 127, 128 and the maintransport mechanism 115 are different, the substrate W can be reliablytransported between the main transport mechanism 127, 128 and the maintransport mechanism 115.

(2-2) Transportation in Indexer Block

The operation of the indexer block 11 will be described below mainlyusing FIGS. 13, 15 and 17.

The main transport mechanism 115 in the present embodiment takes out thesingle unprocessed substrate W from the carrier 113 and transports thesubstrate W to the substrate platform PASS9. Thereafter, the maintransport mechanism 115 takes out another single unprocessed substrate Wfrom the carrier 113, and transports the substrate W to the substrateplatform PASS11.

When the processed substrate W is placed on the substrate platformPASS2, the main transport mechanism 115 takes out the processedsubstrate W from the substrate platform PASS2 after transporting theunprocessed substrate W to the substrate platform PASS9. Then, the maintransport mechanism 115 transports the processed substrate W to thecarrier 113.

Similarly, when the processed substrate W is placed on the substrateplatform PASS4, the main transport mechanism 115 takes out the processedsubstrate W from the substrate platform PASS4 after transporting theunprocessed substrate W to the substrate platform PASS11. Then, the maintransport mechanism 115 transports the processed substrate W to thecarrier 113.

(2-3) Transportation in Sub-Transport Chamber

Next, one example of the transportation in the sub-transport chamber 110will be described mainly using FIGS. 15 and 17.

The sub-transport mechanism 117 sequentially transports the unprocessedsubstrate W among the substrate platform PASS9, the adhesionreinforcement processing unit PAHP and the substrate platform PASS10using the hands H3, H4. Thus, the adhesion reinforcement processing isperformed on the substrate W. Thereafter, the substrate W after theadhesion reinforcement processing is transported to the substrateplatform PASS10.

Similarly, the sub-transport mechanism 118 sequentially transports theunprocessed substrate W among the substrate platform PASS11, theadhesion reinforcement processing unit PAHP and the substrate platformPASS12 using the hands H3, H4. Thus, the adhesion reinforcementprocessing is performed on the substrate W. Thereafter, the substrate Wafter the adhesion reinforcement processing is transported to thesubstrate platform PASS12.

(2-4) Transportation in Processing Block 12

The operation of the processing block 12 will be described below mainlyusing FIGS. 13, 15, 16 and 17.

The main transport mechanism 127 in the upper transport chamber 125sequentially transports the substrate W after the adhesion reinforcementprocessing among the substrate platform PASS10, the one cooling unit CP,the processing chamber 22, the one thermal processing unit PHP, anothercooling unit CP, the processing chamber 21, another thermal processingunit PHP and the substrate platform PASS5 in the upper thermalprocessing section 301 using the hands H1, H2. Thus, the coolingprocessing, the anti-reflection film formation processing, the heatingprocessing and the cooling processing are sequentially performed on thesubstrate W after the adhesion reinforcement processing. Thereafter, thecooling processing, the resist film formation processing, the heatingprocessing and the cooling processing are sequentially performed on thesubstrate W. In this manner, the anti-reflection film and the resistfilm are formed on the substrate W. The substrate W after the resistfilm formation is transported to the substrate platform PASS5.

Further, the main transport mechanism 127 transports the substrate Wafter the development processing placed on the substrate platform PASS6to the substrate platform PASS2 using the hand H1 or the hand H2.

Similarly, the main transport mechanism 128 in the lower transportchamber 126 sequentially transports the substrate W after the adhesionreinforcement processing among the substrate platform PASS11, the onecooling unit CP, the processing chamber 24, the one thermal processingunit PHP, another cooling unit CP, the processing chamber 23, anotherthermal processing unit PHP and the substrate platform PASS7 in thelower thermal processing section 302 using the hands H1, H2. Thus, thecooling processing, the anti-reflection film formation processing, theheating processing and the cooling processing are sequentially performedon the substrate W after the adhesion reinforcement processing.Thereafter, the cooling processing, the resist film formationprocessing, the heating processing and the cooling processing aresequentially performed on the substrate W. Thus, the anti-reflectionfilm and the resist film are formed on the substrate W. The substrate Wafter the resist film formation is transported to the substrate platformPASS7.

Further, the main transport mechanism 128 transports the substrate Wafter the development processing placed on the substrate platform PASS8to the substrate platform PASS4 using the hand H1 or the hand H2.

In a case in which the anti-reflection film can be appropriately formed,while the cooling processing for the substrate W is performed in thecooling unit CP before the anti-reflection film formation processing inthe processing chamber 22, 24 in the example described above, thecooling processing for the substrate W does not have to be performed inthe cooling unit CP for the anti-reflection film formation. Similarly,in a case in which the resist film can be appropriately formed, whilethe cooling processing for the substrate W is performed in the coolingunit CP before the resist film formation processing in the processingchamber 21, 23, the cooling processing for the substrate W does not haveto be performed in the cooling unit CP for the resist film formation.

(2-5) Transportation in Processing Block 13

The operation of the processing block 13 will be described mainly usingFIGS. 13, 15, 16 and 17.

The main transport mechanism 137 in the upper transport chamber 135sequentially transports the substrate W on which the resist film isformed among the substrate platform PASS5, the one cooling unit CP, theprocessing chamber 32, the one thermal processing unit PHP, the edgeexposure unit EEW and the placement/buffer section P-BF1 in the upperthermal processing section 303 using the hands H1, H2. Thus, the coolingprocessing, the resist cover film formation processing, the heatingprocessing and the cooling processing are sequentially performed on thesubstrate Won which the resist film is formed. Thereafter, the edgeexposure processing is performed on the substrate W, and the substrate Wafter the edge exposure processing is transported to theplacement/buffer section P-BF1.

Further, the main transport mechanism 137 sequentially transports thesubstrate W after the exposure processing by the exposure device 15among the one thermal processing unit PHP, the one cooling unit CP, theprocessing chamber 31, another thermal processing unit PHP and thesubstrate platform PASS6 in the upper thermal processing section 303using the hands H1, H2. Thus, the PEB processing, the coolingprocessing, the development processing and the heating processing aresequentially performed on the substrate W after the exposure processing.The substrate W after the development processing is transported to thesubstrate platform PASSE.

Similarly, the main transport mechanism 138 in the lower transportchamber 136 sequentially transports the substrate W on which the resistfilm is formed among the substrate platform PASS7, the one cooling unitCP, the processing chamber 34, the one thermal processing unit PHP, theedge exposure unit EEW and the placement/buffer P-BF2 in the lowerthermal processing section 304 using the hands H1, H2. Thus, the coolingprocessing, the resist cover film formation processing, the heatingprocessing and the cooling processing are sequentially performed on thesubstrate W on which the resist film is formed. Thereafter, the edgeexposure processing is performed on the substrate W, and the substrate Wafter the edge exposure processing is transported to theplacement/buffer section P-BF2.

Further, the main transport mechanism 138 sequentially transports thesubstrate W after the exposure processing by the exposure device 15among the one thermal processing unit PHP, the one cooling unit CP, theprocessing chamber 33, another thermal processing unit PHP and thesubstrate platform PASS8 in the lower thermal processing section 304using the hands H1, H2. Thus, the PEB processing, the coolingprocessing, the development processing and the heating processing aresequentially performed on the substrate W after the exposure processing.The substrate W after the development processing is transported to thesubstrate platform PASS8.

(2-6) Transportation in Cleaning/Drying Processing Block andCarry-In/Carry-Out Block

The operation of the cleaning/drying processing block 14A in the presentembodiment is similar to the operation of the cleaning/drying processingblock 14A in the second embodiment. Further, the operation of thecarry-in/carry-out block 14B in the present embodiment is similar to theoperation of the carry-in/carry-out block 14B in the second embodiment.

(3) Effects

In the substrate processing apparatus 100 according to the presentembodiment, the anti-reflection film formation processing and the resistfilm formation processing are performed on the substrate W by theprocessing block 12, and the resist cover film formation processing andthe development processing are performed on the substrate W by theprocessing block 13. This configuration causes the transportation of thesubstrate W to the adhesion reinforcement processing unit PAHP in thefirst processing section 121 in the processing block 12 to be performedby the sub-transport mechanisms 117, 118. Therefore, the number oftransportation steps by the main transport mechanisms 127, 128 isreduced. Thus, a burden on the main transport mechanisms 127, 128 can bereduced. As a result, throughput of the substrate processing apparatus100 can be improved.

[4] Other Embodiments

(1) The processing block 13 does not have to be provided in thesubstrate processing apparatus 100 according to the second or the thirdembodiment. In this case, the indexer block 11 is a first processingregion, the processing block 12 is a second processing region and theinterface block 14 is a third processing region.

(2) In the substrate processing apparatus 100 according to the first tothird embodiments, another processing block may be provided between theindexer block 11 and the processing block 12. In this case, the indexerblock 11 is the first processing region, another processing block is thesecond processing region, the processing block 12 is the thirdprocessing region and the processing block 13 is the fourth processingregion.

(3) In the substrate processing apparatus 100 according to the first tothird embodiments, the carry-in/carry-out sections for the substrates Wmay be provided at the side surfaces of the cooling units CP in theupper thermal processing section 301 and the lower thermal processingsection 302 adjacent to the sub-transport chamber 110. Thus, thesub-transport mechanisms 117, 118 can directly carry in the substrates Wfrom and carry out the substrates W to the cooling units CP. In thiscase, the cooling units CP can be used as the substrate platforms, sothat the substrate platforms PASS9 to PASS12 do not have to be provided.

(4) In the substrate processing apparatus 100 according to the first tothird embodiments, the carry-in/carry-out sections for the substrates Wmay be provided at the side surfaces of the cooling units CP in theupper thermal processing section 303 and the lower thermal processingsection 304 adjacent to the sub-transport chamber 110. Thus, thesub-transport mechanisms 117, 118 can directly carry in the substrates Wfrom and carry out the substrates W to the cooling units CP. In thiscase, the cooling units CP can be used as the substrate platforms, sothat the substrate platforms PASS13 to PASS16 do not have to beprovided.

(5) In the substrate processing apparatus 100 according to the thirdembodiment, the carry-in/carry-out sections for the substrates W may beprovided at the side surfaces of the adhesion reinforcement processingunits PAHP in the upper thermal processing section 303 and the lowerthermal processing section 304 adjacent to the transport section 112.Thus, the main transport mechanisms 127, 128 can directly carry in thesubstrates W from and carry out the substrates W to the adhesionreinforcement processing units PAHP. In this case, the adhesionreinforcement processing units PAHP can be used as the substrateplatforms, so that the substrate platforms PASS9 to PASS12 do not haveto be provided.

[5] Correspondences Between Constituent Elements in Claims and Parts inPreferred Embodiments

In the following paragraphs, non-limiting examples of correspondencesbetween various elements recited in the claims below and those describedabove with respect to various preferred embodiments of the presentinvention are explained.

In the embodiment described above, the substrate processing apparatus100 is an example of a substrate processing apparatus, the indexer block11 is an example of a first processing region, the processing block 12is an example of a second processing region, the processing block 13 isan example of a third processing region and the interface block 14 is anexample of a fourth processing region. The sub-transport chamber 110 isan example of a sub-transport region, the transport section 122 is anexample of a first main transport region, the transport section 132 isan example of a second main transport region and the sub-transportmechanisms 117, 118 are examples of a sub-transport mechanism.

The main transport mechanism 115 is an example of a first main transportmechanism, the main transport mechanisms 127, 128 are examples of asecond main transport mechanism, the main transport mechanisms 137, 138are examples of a third main transport mechanism and the main transportmechanisms 141, 142, 146 are examples of a fourth main transportmechanism. The first processing section 121 and the thermal processingsection 123 are examples of a first processing section, the secondprocessing section 131 and the thermal processing section 133 areexamples of a second processing section, the spin chuck 25 and the cup27 are examples of a first liquid processing unit and the spin chuck 35and the cup 37 are examples of a second liquid processing unit.

The thermal processing unit PHP, the cooling unit CP or the adhesionreinforcement processing unit PAHP are examples of a first thermalprocessing unit and the thermal processing unit PHP or the cooling unitCP is an example of a second thermal processing unit. The firstprocessing section 121 is an example of a first liquid processingregion, the second processing section 131 is an example of a secondliquid processing region, the thermal processing section 123 is anexample of a first thermal processing region and the thermal processingsection 133 is an example of a second thermal processing region.

The upper thermal processing section 301 is an example of a first upperprocessing section, the lower thermal processing section 302 is anexample of a first lower processing section, the upper thermalprocessing section 303 is an example of a second upper processingsection and the lower thermal processing section 304 is an example of asecond lower processing section. The main transport mechanism 127 is anexample of a first upper main transport mechanism, the main transportmechanism 128 is an example of a first lower main transport mechanism,the main transport mechanism 137 is an example of a second upper maintransport mechanism and the main transport mechanism 138 is an exampleof a second lower main transport mechanism.

The sub-transport mechanism 118 is an example of a first sub-transportmechanism, the sub-transport mechanism 117 is an example of a secondsub-transport mechanism, the thermal processing unit PHP, the coolingunit CP or the adhesion reinforcement processing unit PAHP is an exampleof a processing unit, the carrier 113 is an example of a substratestorage container and the carrier platform 111 is an example of acontainer platform.

In the substrate processing apparatus 100 according to the first orsecond embodiment, the substrate platforms PASS9 to PASS12 are examplesof a first substrate platform, and the substrate platforms PASS13 toPASS16 are examples of a second substrate platform. In the substrateprocessing apparatus 100 according to the third embodiment, thesubstrate platforms PASS9, PASS11 are examples of a first substrateplatform, the substrate platforms PASS2, PASS4 are examples of a secondsubstrate platform and the substrate platforms PASS5 to PASS8 areexamples of a third substrate platform.

As each of constituent elements recited in the claims, various otherelements having configurations or functions described in the claims canbe also used.

INDUSTRIAL APPLICABILITY

The present invention can be effectively utilized for various substrateprocessing.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing the scope andspirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

I/We claim:
 1. A substrate processing apparatus comprising: first,second and third processing regions; and a sub-transport region, whereinthe second processing region is arranged between the first processingregion and the third processing region, the first processing regionincludes a first main transport mechanism that transports a substrate,the second processing region includes a first processing section thatperforms processing on the substrate and a second main transportmechanism that transports the substrate, the first processing sectionincludes a plurality of first processing units, the third processingregion includes a third main transport mechanism that transports thesubstrate, the sub-transport region includes a sub-transport mechanismthat transports the substrate, the sub-transport mechanism is configuredto transport the substrate between the first main transport mechanismand at least one first processing unit of the plurality of firstprocessing units, and the second main transport mechanism is configuredto carry in the substrate from and carry out the substrate to anotherfirst processing unit of the plurality of first processing units, toreceive the substrate from and transfer the substrate to the first maintransport mechanism and to receive the substrate from and transfer thesubstrate to the third main transport mechanism.
 2. The substrateprocessing apparatus according to claim 1, further comprising: a firstsubstrate platform on which the substrate that is transported betweenthe first main transport mechanism and the sub-transport mechanism istemporarily placed and the substrate that is transported between thesub-transport mechanism and the second main transport mechanism istemporarily placed.
 3. The substrate processing apparatus according toclaim 2, wherein the plurality of first processing units include aliquid processing unit that performs processing using a processingliquid and a thermal processing unit that performs thermal processing onthe substrate, the at least one processing unit includes the thermalprocessing unit, the second processing region includes a liquidprocessing region in which the liquid processing unit is arranged, athermal processing region in which the thermal processing unit isarranged and a main transport region in which the second main transportmechanism is arranged, the main transport region is arranged between theliquid processing region and the thermal processing region, thesub-transport region is provided on an opposite side to the maintransport region with respect to the thermal processing region, and thefirst substrate platform is arranged between the main transport regionand the sub-transport region.
 4. The substrate processing apparatusaccording to claim 1, further comprising: a second substrate platform onwhich the substrate that is received and transferred between the firstmain transport mechanism and the second main transport mechanism istemporarily placed, and a third substrate platform on which thesubstrate that is transported between the second main transportmechanism and the third main transport mechanism is temporarily placed.5. The substrate processing apparatus according to claim 1, wherein thefirst processing region further includes a container platform on which asubstrate storing container that stores the substrate is placed, and thefirst main transport mechanism is configured to transport the substratebetween the substrate storing container placed on the container platformand the second main transport mechanism and to transport the substratebetween the substrate storing container placed on the container platformand the sub-transport mechanism.
 6. The substrate processing apparatusaccording to claim 1, further comprising: a fourth processing regionarranged to be adjacent to the third processing region, wherein thefourth processing region includes a fourth main transport mechanism thattransports the substrate, the third processing region further includes asecond processing section that performs processing on the substrate, andthe third main transport mechanism is configured to transport thesubstrate among the sub-transport mechanism, the second processingsection and the fourth main transport mechanism.
 7. The substrateprocessing apparatus according to claim 6, wherein, the secondprocessing section includes a plurality of second processing units, thesub-transport mechanism receives the substrate from and transfers thesubstrate to at least one second processing unit of the plurality ofsecond processing units, and the third main transport mechanism isconfigured to receive the substrate from and transfer the substrate toanother second processing unit of the plurality of second processingunits.
 8. A substrate processing method using a substrate processingapparatus that includes first, second and third processing regions and asub-transport region, the second processing region being arrangedbetween the first processing region and the third processing region,comprising the steps of: transporting a substrate by a first maintransport mechanism arranged in the first processing region; receivingthe substrate from and transferring the substrate to the first maintransport mechanism by a second main transport mechanism arranged in thesecond processing region; performing processing on the substrate by aplurality of processing units arranged in the second processing region;transporting the substrate between the first main transport mechanismand at least one processing unit of the plurality of processing unitsand transporting the substrate between the at least one processing unitand the second main transport mechanism by a sub-transport mechanismarranged in the sub-transport region; transporting the substrate betweenthe first main transport mechanism and another processing unit of theplurality of processing units by the second main transport mechanism;receiving the substrate from and transferring the substrate to the thirdmain transport mechanism by the second main transport mechanism; andtransporting the substrate by a third main transport mechanism arrangedin the third processing region.